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Senior Scientist, Multi-Layered Wiring

  • On-site
  • Finland
  • English
  • Posted 07.09.26 21:23

Are you a seasoned nanofabrication expert ready to take technical ownership of a critical quantum hardware technology? We are offering an opportunity to lead the development of superconducting multi-layered wiring processes from advanced R&D towards scalable, pilot-ready manufacturing. Would you like to shape process roadmaps, mentor colleagues, and remain deeply hands-on in world-class facilities? VTT might be just the place for you.

VTT is one of the leading applied research organisations in Europe. What unites us are curiosity, a passion for learning, and a purpose: to solve the biggest challenges of our time and turn them into sustainable growth and well-being. Our cross-disciplinary community of over 2000 brilliant minds from 55+ different nationalities focuses on creating impact through science-based innovation. In recent years, we have created ground-breaking innovations such as the world's fastest and most accurate radiation detector, a cancer-sniffing sensor device for smartphones, and a headphone set entirely made of microbial materials. Get to know us further by exploring VTT's tech & infra .

We are now looking for Senior Scientist, Multi-Layered Wiring to join our Quantum Scaling and Integration team.

You will join our Quantum Scaling and Integration Team and provide technical leadership across the full multi-layered wiring process stack on 200 mm wafers, from process development and integration to yield optimization and pilot-production readiness. In this senior role, you will work with significant autonomy, define technical priorities, lead process scale-up, and guide junior colleagues. You will combine strategic direction with hands-on cleanroom work and data-driven process improvement.

Our Quantum Scaling and Integration Team develops advanced technologies for scaling superconducting quantum processors, from TSVs and multilayer wiring to flip-chip integration and full QPU module concepts. We work closely with leading European industrial and academic partners to enable reproducible, wafer-scale fabrication and pilot-ready processes for future quantum computing systems.

As Senior Scientist, Multi-Layered Wiring, you will:

Lead the development, optimization, and qualification of multi-layered superconducting wiring processes on 200 mm wafersProvide expert leadership in thin film deposition, lithography, dry etching, and wet processingDefine and drive process integration, transfer, scaling, and tool-matching strategiesDevelop the technical roadmap for MLW modules in alignment with QPU scaling objectivesDesign and lead DOE campaigns with clear yield and performance targetsEstablish SPC, process monitoring, yield KPIs, and production-quality guardrailsLead characterization and data analysis to improve uniformity, reproducibility, and device performanceDrive production ramp-up planning, risk mapping, and pilot-scale readinessLead technical contributions to EU projects, publications, and external partnershipsMentor junior colleagues and strengthen team capability, documentation, and safety culture

Who we are looking for

For this position, we are looking for an experienced micro- and nanofabrication specialist who can take ownership of a complex technology area and lead its transition from research towards reproducible pilot-scale production.PhD in applied physics, electrical engineering, materials science, micro/nanotechnology, or similarAt least 6 years of hands-on cleanroom experience, including PhD or postdoctoral workExpert-level experience in lithography, dry etching, wet processing, thin film deposition, and integration flowsStrong experience with DOE, metrology, SPC, yield analysis, and data-driven process optimizationDemonstrated track record of scaling R&D processes towards pilot productionAbility to independently own technical workstreams and guide junior colleaguesWe also appreciate experience in experience with superconducting film integration or quantum device fabrication; knowledge of CMP, wafer bonding, or advanced packaging; familiarity with in-line characterization, mask design, RF simulations, or scientific programming.

As a person, we hope that you are

Strategic and hands-on, able to lead both from the cleanroom and the planning tableA natural mentor who supports the development of junior colleaguesRigorous and data-driven, with a strong focus on reproducibility and documentationA proactive problem solver who turns technical complexity into clear prioritiesAn excellent communicator with internal and external stakeholdersCommitted to quality, safety, collaboration, and continuous improvement

Apply now and join our community of brilliant minds!

Please send your CV with your salary request via our recruitment system as soon as possible but at the latest by 23 September 2026.

Interested and want to know more?

For further information, please contact Research Team Leader Harshad Mishra, harshad.mishra@vtt.fi, +358 50 525 7122

We look forward to hearing from you!

VTT Location: Tietotie 3, Espoo