Camera Module (Hardware) Consultant - Finland (Contract)

You'll be an integral member of our Camera Module Hardware team, working hands-on across the full development cycle — from early schematic capture through bring-up, characterization, and evaluation reporting — and we're looking for an engineer passionate about delivering novel, high-quality hardware for millions of users. Job Descriptions:Designing, prototyping, and testing camera module assemblies for next-generation smartphonesCapturing schematics and owning PCB layout and routing for evaluation boards and prototypesGetting hands-on in the lab: soldering, wiring, probing, and measuring — you'll know your way around a benchBringing up image sensors, actuators, and power management circuits from scratchConfiguring image sensors and actuators at the firmware level, including still image and video streaming pipelinesRunning a full suite of electrical measurements — analog and digital — to validate designs and chase down root causesPerforming simulations across electrical, electromagnetic, EMI, and signal integrity domainsTranslating findings into clear, rigorous evaluation reports for engineering peers and executive stakeholdersQualifications and detailed requirements:MSc or PhD degree in electrical engineering or other relevant fieldsHands-on experience in electronics hardware engineering, ideally in consumer electronics or mobileSolid grounding in PCB design — schematic capture, layout, and routing — with a practical understanding of signal integrity and EMI considerationsComfortable at the bench: you solder, probe, and measure without hesitationExperience bringing up mixed-signal systems, including image sensors, VCMs, or power management ICsSome exposure to firmware-level device control (I²C, SPI, MIPI CSI-2, or similar)Strong written communication — you can write a teardown report that's effective both at engineering and executive levelsFluent in English, both written and spokenBig advantage for contestants from international competitions in computer science, mathematics, or physics (e.g. IOI, IMO, ICPC, IPhO, IChO)Nice to Have Skills:Hands-on experience with camera module characterization (MTF, noise, OIS performance, etc.)Familiarity with MIPI standards or ISP tuning workflowsAble to run simulations and interpret results across electrical and EM domainsExperience in a fast-paced, high-ownership engineering environment